Show simple item record

Modeling of thermal vias in thin film multichip modules

dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorBerghmans, J.
dc.date.accessioned2021-09-29T12:40:08Z
dc.date.available2021-09-29T12:40:08Z
dc.date.issued1994
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/77
dc.sourceIIOimport
dc.titleModeling of thermal vias in thin film multichip modules
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.source.peerreviewno
dc.source.beginpage101
dc.source.endpage107
dc.source.conferenceIntersociety Conference on Thermal Phenomena in Electronic Systems. I-THERM IV. "Concurrent Engineering and Thermal Phenomena"
dc.source.conferencedate04/05/1994
dc.source.conferencelocationWashington, DC USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record