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Modeling of thermal vias in thin film multichip modules
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Authors
Christiaens, Filip
;
Beyne, Eric
;
Berghmans, J.
Conference
Intersociety Conference on Thermal Phenomena in Electronic Systems. I-THERM IV. "Concurrent Engineering and Thermal Phenomena"
Title
Modeling of thermal vias in thin film multichip modules
Publication type
Proceedings paper
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