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Modeling of thermal vias in thin film multichip modules
Publication:
Modeling of thermal vias in thin film multichip modules
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Date
1994
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Christiaens, Filip
;
Beyne, Eric
;
Berghmans, J.
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Abstract
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33211
since deposited on 2021-09-29
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Acq. date: 2025-12-15
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Metrics
Views
33211
since deposited on 2021-09-29
1
last month
Acq. date: 2025-12-15
Citations