Publication:
Modeling of thermal vias in thin film multichip modules
Date
| dc.contributor.author | Christiaens, Filip | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Berghmans, J. | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.date.accessioned | 2021-09-29T12:40:08Z | |
| dc.date.available | 2021-09-29T12:40:08Z | |
| dc.date.issued | 1994 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/77 | |
| dc.source.beginpage | 101 | |
| dc.source.conference | Intersociety Conference on Thermal Phenomena in Electronic Systems. I-THERM IV. "Concurrent Engineering and Thermal Phenomena" | |
| dc.source.conferencedate | 04/05/1994 | |
| dc.source.conferencelocation | Washington, DC USA | |
| dc.source.endpage | 107 | |
| dc.title | Modeling of thermal vias in thin film multichip modules | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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