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Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements

dc.contributor.authorPfeiffer, Ullrich
dc.contributor.authorChandrasekhar, Arun
dc.date.accessioned2021-10-15T06:07:10Z
dc.date.available2021-10-15T06:07:10Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8003
dc.sourceIIOimport
dc.titleStatistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conference12th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP
dc.source.conferencedate27/10/2003
dc.source.conferencelocationPrinceton USA
imec.availabilityPublished - imec


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