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Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds

dc.contributor.authorRatchev, Petar
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorHo, Meng
dc.contributor.authorVerlinden, B.
dc.contributor.authorBender, Hugo
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T06:20:14Z
dc.date.available2021-10-15T06:20:14Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8060
dc.sourceIIOimport
dc.titleEffect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
dc.typeProceedings paper
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage126
dc.source.endpage132
dc.source.conferenceIMAPS-Nordic
dc.source.conferencedate21/09/2003
dc.source.conferencelocationEspoo Finland
imec.availabilityPublished - imec


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