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Conference contributions
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
Publication:
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
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Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ratchev, Petar
;
Vandevelde, Bart
;
De Wolf, Ingrid
Journal
Abstract
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1816
since deposited on 2021-10-15
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Acq. date: 2025-12-16
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Metrics
Views
1816
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-16
Citations