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Reliability and failure modes of SnAgCu solder joints for PSGA packages

dc.contributor.authorRatchev, Petar
dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T06:20:42Z
dc.date.available2021-10-15T06:20:42Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8062
dc.sourceIIOimport
dc.titleReliability and failure modes of SnAgCu solder joints for PSGA packages
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage81
dc.source.conferenceProceedings of the IPC and Soldertec Global Conference on Lead Free Electronics
dc.source.conferencedate11/06/2003
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - imec


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