dc.contributor.author | Ratchev, Petar | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | De Wolf, Ingrid | |
dc.date.accessioned | 2021-10-15T06:20:42Z | |
dc.date.available | 2021-10-15T06:20:42Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8062 | |
dc.source | IIOimport | |
dc.title | Reliability and failure modes of SnAgCu solder joints for PSGA packages | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.source.peerreview | no | |
dc.source.beginpage | 81 | |
dc.source.conference | Proceedings of the IPC and Soldertec Global Conference on Lead Free Electronics | |
dc.source.conferencedate | 11/06/2003 | |
dc.source.conferencelocation | Brussels Belgium | |
imec.availability | Published - imec | |