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Self-aligned 0-level sealing of MEMS devices by a two-layer thin film reflow process

dc.contributor.authorRusu, Cristina
dc.contributor.authorJansen, Henri
dc.contributor.authorGunn, Robert
dc.date.accessioned2021-10-15T06:28:29Z
dc.date.available2021-10-15T06:28:29Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8095
dc.sourceIIOimport
dc.titleSelf-aligned 0-level sealing of MEMS devices by a two-layer thin film reflow process
dc.typeProceedings paper
dc.source.peerreviewno
dc.source.beginpage245
dc.source.endpage250
dc.source.conferenceDesign, Test, Integration and Packaging of MEMS/MOEMS - DTIP of MEMS & MOEMS
dc.source.conferencedate5/05/2003
dc.source.conferencelocationCannes France
imec.availabilityPublished - imec


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