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Copper seed layer scaling for advanced interconnects: extendibility of I-PVD

dc.contributor.authorTokei, Zsolt
dc.contributor.authorDemuynck, Steven
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMebarki, Bencherki
dc.contributor.authorMandrekar, T.
dc.contributor.authorGuggilla, S.
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T06:59:05Z
dc.date.available2021-10-15T06:59:05Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8217
dc.sourceIIOimport
dc.titleCopper seed layer scaling for advanced interconnects: extendibility of I-PVD
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage403
dc.source.endpage407
dc.source.conferenceProceedings of the Advanced Metallization Conference 2002
dc.source.conferencedate1/10/2002
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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