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Results of a high density flip chip on flex reliability test program

dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorMäättänen, Jarmo
dc.contributor.authorLaitinen, Tanja
dc.contributor.authorde Maquillé, Yannick
dc.date.accessioned2021-10-15T07:23:26Z
dc.date.available2021-10-15T07:23:26Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8310
dc.sourceIIOimport
dc.titleResults of a high density flip chip on flex reliability test program
dc.typeProceedings paper
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage6
dc.source.conference26th International Spring Seminar on Electronics Technology. Integrated Management of Electronic Materials Production. ISSE
dc.source.conferencedate8/05/2003
dc.source.conferencelocationStara Lesna Slovakia
imec.availabilityPublished - imec


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