dc.contributor.author | Vanden Bulcke, Mathieu | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Winters, Christophe | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Larson, L. | |
dc.contributor.author | Harkness, B.R. | |
dc.contributor.author | Gardner, G. | |
dc.contributor.author | Mohamed, M. | |
dc.contributor.author | Sudbury-Holtschlag, J. | |
dc.contributor.author | Meynen, H. | |
dc.date.accessioned | 2021-10-15T07:23:44Z | |
dc.date.available | 2021-10-15T07:23:44Z | |
dc.date.issued | 2003 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8311 | |
dc.source | IIOimport | |
dc.title | Introducing a silicone under the bump configuration for stress relief in a wafer level package | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vanden Bulcke, Mathieu | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Winters, Christophe | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 380 | |
dc.source.endpage | 384 | |
dc.source.conference | Proceedings EPTC - Electronics Packaging Technology Conference | |
dc.source.conferencedate | 11/12/2003 | |
dc.source.conferencelocation | Singapore | |
imec.availability | Published - imec | |