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High-k materials for tunnel barrier engineering in future memory technologies

dc.contributor.authorBlomme, Pieter
dc.contributor.authorGovoreanu, Bogdan
dc.contributor.authorRosmeulen, Maarten
dc.contributor.authorAkheyar, Amal
dc.contributor.authorHaspeslagh, Luc
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorLorenzini, Martino
dc.contributor.authorVan Houdt, Jan
dc.contributor.authorDe Meyer, Kristin
dc.date.accessioned2021-10-15T12:44:18Z
dc.date.available2021-10-15T12:44:18Z
dc.date.issued2004-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8593
dc.sourceIIOimport
dc.titleHigh-k materials for tunnel barrier engineering in future memory technologies
dc.typeMeeting abstract
dc.contributor.imecauthorBlomme, Pieter
dc.contributor.imecauthorGovoreanu, Bogdan
dc.contributor.imecauthorRosmeulen, Maarten
dc.contributor.imecauthorHaspeslagh, Luc
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan Houdt, Jan
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.orcidimecRosmeulen, Maarten::0000-0002-3663-7439
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan Houdt, Jan::0000-0003-1381-6925
dc.source.peerreviewno
dc.source.beginpage868
dc.source.conferenceExtended Abstracts 206th Electrochemical Society Meeting
dc.source.conferencedate3/10/2004
dc.source.conferencelocationHonolulu, HI USA
imec.availabilityPublished - imec


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