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Hard pellicle investigation for 157 nm lithography: impact on overlay

dc.contributor.authorBruls, R.
dc.contributor.authorUitterdijk, T.
dc.contributor.authorCicilia, O.
dc.contributor.authorDe Bisschop, Peter
dc.contributor.authorKocsis, Michael
dc.contributor.authorGrenville, A.
dc.contributor.authorVan Peski, C.
dc.contributor.authorEngelstad, R.
dc.contributor.authorChang, J.
dc.contributor.authorCotte, E.
dc.contributor.authorOkada, K.
dc.contributor.authorOhta, K.
dc.contributor.authorMishiro, H.
dc.contributor.authorKikugawa, S.
dc.date.accessioned2021-10-15T12:48:20Z
dc.date.available2021-10-15T12:48:20Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8643
dc.sourceIIOimport
dc.titleHard pellicle investigation for 157 nm lithography: impact on overlay
dc.typeProceedings paper
dc.contributor.imecauthorDe Bisschop, Peter
dc.contributor.imecauthorKocsis, Michael
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage11
dc.source.conference20th European Mask Conference on Mask Technology for Integrated Circuits and Microcomponents
dc.source.conferencedate12/01/2004
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 5504


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