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Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers

dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorFisher, A.H.
dc.contributor.authorUngar, F.
dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorSutcliffe, Victor
dc.contributor.authorMichelon, Julien
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T12:48:30Z
dc.date.available2021-10-15T12:48:30Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8645
dc.sourceIIOimport
dc.titleComprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage12
dc.source.endpage14
dc.source.conferenceProceedings of the IEEE International Interconnect Technology Conference
dc.source.conferencedate7/06/2004
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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