Filling of 80 nm structures using a novel copper oxide reduction and reflow approach

No Thumbnail [100%x80]
Metadata
Show full item record
Authors
Carbonell, Laure; Palmans, Roger; Travaly, Youssef; Brongersma, Sywert; Maex, Karen
Conference
Advanced Metallization Conference
Title
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Publication type
Oral presentation
Collections