dc.contributor.author | Carbonell, Laure | |
dc.contributor.author | Palmans, Roger | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Brongersma, Sywert | |
dc.contributor.author | Maex, Karen | |
dc.date.accessioned | 2021-10-15T12:49:08Z | |
dc.date.available | 2021-10-15T12:49:08Z | |
dc.date.issued | 2004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8652 | |
dc.source | IIOimport | |
dc.title | Filling of 80 nm structures using a novel copper oxide reduction and reflow approach | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Brongersma, Sywert | |
dc.contributor.imecauthor | Maex, Karen | |
dc.contributor.orcidimec | Brongersma, Sywert::0000-0002-1755-3897 | |
dc.source.peerreview | no | |
dc.source.conference | Advanced Metallization Conference | |
dc.source.conferencedate | 19/10/2004 | |
dc.source.conferencelocation | San Diego, CA USA | |
imec.availability | Published - imec | |