Publication:
Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
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1851 since deposited on 2021-10-15
3last month
Acq. date: 2026-10-13
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Statistics
Views
1851 since deposited on 2021-10-15
3last month
Acq. date: 2026-10-13
Citations