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Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints

dc.contributor.authorRatchev, Petar
dc.contributor.authorLabie, Riet
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T15:45:51Z
dc.date.available2021-10-15T15:45:51Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9496
dc.sourceIIOimport
dc.titleNanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage339
dc.source.endpage342
dc.source.conferenceProceedings 6th Electronic Packaging Technology Conference - EPTC
dc.source.conferencedate8/12/2004
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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