dc.contributor.author | Ratchev, Petar | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-15T15:45:51Z | |
dc.date.available | 2021-10-15T15:45:51Z | |
dc.date.issued | 2004 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9496 | |
dc.source | IIOimport | |
dc.title | Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 339 | |
dc.source.endpage | 342 | |
dc.source.conference | Proceedings 6th Electronic Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 8/12/2004 | |
dc.source.conferencelocation | Singapore | |
imec.availability | Published - imec | |