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Atomic layer deposited barriers for copper interconnects

dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorMartin Hoyas, Ana
dc.contributor.authorErnur, Didem
dc.contributor.authorTokei, Zsolt
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorSatta, Alessandra
dc.contributor.authorWhelan, Caroline
dc.contributor.authorShamiryan, Denis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorAbell, Thomas
dc.contributor.authorSutcliffe, Victor
dc.contributor.authorSchaekers, Marc
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T16:07:51Z
dc.date.available2021-10-15T16:07:51Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9574
dc.sourceIIOimport
dc.titleAtomic layer deposited barriers for copper interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.source.peerreviewno
dc.source.beginpageTF-MoM1
dc.source.conferenceAVS 51 International Symposium
dc.source.conferencedate14/11/2004
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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