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Process and properties of ALD tungsten nitride carbide barrier films for interconnects

dc.contributor.authorSchuhmacher, Jörg
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyer, Gerald
dc.contributor.authorStokhof, Maarten
dc.contributor.authorSchaekers, Marc
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T16:08:10Z
dc.date.available2021-10-15T16:08:10Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9575
dc.sourceIIOimport
dc.titleProcess and properties of ALD tungsten nitride carbide barrier films for interconnects
dc.typeProceedings paper
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStokhof, Maarten
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage755
dc.source.endpage759
dc.source.conferenceAdvanced Metallization Conference 2003
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal Canada
imec.availabilityPublished - open access
imec.internalnotesConference Proceedings AMC XIX


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