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Barrier reliability on sub-100nm copper low-k interconnects

dc.contributor.authorTokei, Zsolt
dc.contributor.authorGailledrat, T.
dc.contributor.authorLi, Yunlong
dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorMandrekar, T.
dc.contributor.authorGuggilla, S.
dc.contributor.authorMebarki, Bencherki
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T16:40:51Z
dc.date.available2021-10-15T16:40:51Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9684
dc.sourceIIOimport
dc.titleBarrier reliability on sub-100nm copper low-k interconnects
dc.typeOral presentation
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.source.peerreviewno
dc.source.conferenceAdvanced Metallization Conference
dc.source.conferencedate19/10/2004
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec


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