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Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects

dc.contributor.authorTokei, Zsolt
dc.contributor.authorSutcliffe, Victor
dc.contributor.authorDemuynck, Steven
dc.contributor.authorIacopi, Francesca
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHoofman, Romano
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T16:41:30Z
dc.date.available2021-10-15T16:41:30Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9686
dc.sourceIIOimport
dc.titleImpact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorHoofman, Romano
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecHoofman, Romano::0000-0001-8740-104X
dc.source.peerreviewno
dc.source.beginpage326
dc.source.endpage332
dc.source.conferenceProceedings IEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate27/04/2004
dc.source.conferencelocationPhoenix, AZ USA
imec.availabilityPublished - imec


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