Show simple item record

Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages

dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.date.accessioned2021-10-15T17:26:15Z
dc.date.available2021-10-15T17:26:15Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9829
dc.sourceIIOimport
dc.titleInfluence of printed circuit board properties on solder joint fatigue life of assembled IC packages
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage65
dc.source.endpage70
dc.source.conferenceProceedings European Microelectronics Packaging Symposium (IMAPS Europe)
dc.source.conferencedate16/06/2004
dc.source.conferencelocationPrague Czech Republic
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record