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Lead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations

dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, Mario
dc.contributor.authorLimaye, Paresh
dc.contributor.authorRatchev, Petar
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T17:26:54Z
dc.date.available2021-10-15T17:26:54Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9831
dc.sourceIIOimport
dc.titleLead free solder joint reliability estimation by finite element modelling, advantages, challenges and limitations
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference7th IPC International Conference on Lead Free Electronic Components and Assemblies
dc.source.conferencedate21/10/2004
dc.source.conferencelocationFrankfurt Germany
imec.availabilityPublished - imec
imec.internalnotesProceedings on CD-ROM


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