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Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
Publication:
Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
Date
2004
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wu, Wen
;
Brongersma, Sywert
;
Van Hove, Marleen
;
Maex, Karen
Journal
Applied Physics Letters
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1875
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
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Views
1875
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations