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Thickness and temperature dependent resistivity of thin copper films

dc.contributor.authorZhang, Wenqi
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorClarysse, Trudo
dc.contributor.authorWu, Wen
dc.contributor.authorVervoort, Iwan
dc.contributor.authorPalmans, Roger
dc.contributor.authorHoflijk, Ilse
dc.contributor.authorBender, Hugo
dc.contributor.authorHui, W.
dc.contributor.authorCarbonell, Laure
dc.contributor.authorRosseel, Erik
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T18:14:17Z
dc.date.available2021-10-15T18:14:17Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9974
dc.sourceIIOimport
dc.titleThickness and temperature dependent resistivity of thin copper films
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorHoflijk, Ilse
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage219
dc.source.endpage224
dc.source.conferenceAdvanced Metallization Conference 2003
dc.source.conferencedate21/10/2003
dc.source.conferencelocationMontreal/Tokyo
imec.availabilityPublished - open access
imec.internalnotesConference Proceedings AMC XIX


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