Browsing by Author "Allaert, Bart"
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Publication A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Proceedings paper2005, Proceedings of the 15th European Microelectronics and Packaging Conference and Exhibition - EPMC, 12/06/2005, p.248-252Publication Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Proceedings paper2018, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-6Publication Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Proceedings paper2016-04, 17th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectr. and Microsyst. - EuroSimE, 17/04/2016Publication Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Journal article2017, Microelectronics Reliability, 74, p.131-135Publication Hidden-head-in-pillow soldering failures
Proceedings paper2014, 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 6/04/2014, p.1-6Publication How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Proceedings paper2016-04, International Conference on Electronics Packaging - ICEP, 20/04/2016, p.94-98Publication Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Proceedings paper2013, European Microelectronics and Packaging Conference - EMPC, 9/09/2013Publication In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
Proceedings paper2017, 18th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 2/04/2017, p.1-5Publication Low-temperature enbrittlement of lead-free solders in joint level impact testing
Proceedings paper2007-12, 9th Electronics Packaging Conference - EPTC, 10/12/2007, p.140-151Publication Second level joint failures due to excessive warpage of advanced IC packages
Meeting abstract2013, Materials for Advanced Metallization - MAM, 10/03/2013, p.165-166Publication Study of a Narrow Fabric-Based E-Textile System-From Research to Field Tests
Journal article2024, SENSORS, (24) 14, p.Art. 4624Publication Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
Proceedings paper2018-04, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-8