Browsing by Author "Araga, Yuuki"
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Publication A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring
Proceedings paper2014, Electronics System-Integration Technology Conference - ESTC, 16/09/2014, p.1-5Publication A study on substrate noise coupling among TSVs in 3D chip stack
Journal article2018, IEICE Electronics Express, (15) 13, p.20180460Publication In-tier diagnosis of power domains in 3D TSV ICs
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012, p.7-FebPublication Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits
; ; Journal article2014-06, IEEE Transactions on Components, Packaging and Manufacturing Technology, (4) 6, p.1026-1037