Browsing by Author "Baklanov, Mikhail"
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Publication Cu passivation for integration of gap-filling ultralow-k dielectrics
Journal article2016, Applied Physics Letters, (109) 23, p.232901Publication Integration of porous low-k dielectrics using post porosity pore protection
Journal article2016, Journal of Physics D: Applied Physics, (49) 50, p.505105Publication Laser anneal of oxycarbosilane low-k film
Proceedings paper2016, International Interconnect Technology Conference/ Advanced Metallization Conference, 23/05/2016, p.156-158Publication Optimized pore stuffing for enhanced compatibility with interconnect integration flow
; ; ; Publication Ultra low-k etching by neutral beams produced from CF4/Ar and SF6/Ar ICP plasmas
Meeting abstract2016, Plasma Etch and Strip in Microtechnology - PESM, 9/05/2016