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Optimized pore stuffing for enhanced compatibility with interconnect integration flow
Publication:
Optimized pore stuffing for enhanced compatibility with interconnect integration flow
Date
2015
Proceedings Paper
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31514.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
de Marneffe, Jean-Francois
;
Zhang, Liping
;
Rutigliani, Vito
;
Noya, G.
;
Cao, Yi
;
Lesniewska, Alicja
;
Varela Pedreira, Olalla
;
Croes, Kristof
;
Gillot, Christophe
;
Tokei, Zsolt
;
Boemmels, Juergen
;
Baklanov, Mikhaïl
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1915
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations
Metrics
Views
1915
since deposited on 2021-10-22
Acq. date: 2025-10-23
Citations