Publication:

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

Date

2015
Proceedings Paper
https://doi.org/10.1109/IITC-MAM.2015.7325639
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dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorZhang, Liping
dc.contributor.authorRutigliani, Vito
dc.contributor.authorNoya, G.
dc.contributor.authorCao, Yi
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCroes, Kristof
dc.contributor.authorGillot, Christophe
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorBaklanov, Mikhail
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-22T18:50:51Z
dc.date.available2021-10-22T18:50:51Z
dc.date.embargo9999-12-31
dc.date.issued2015
dc.identifier.doi10.1109/IITC-MAM.2015.7325639
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25142
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325639
dc.publisherIEEE
dc.source.beginpage91
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate2015-05-18
dc.source.conferencelocationGrenoble France
dc.source.endpage94
dc.title

Optimized pore stuffing for enhanced compatibility with interconnect integration flow

dc.typeProceedings paper
dspace.entity.typePublication
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