Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Articles
Cu passivation for integration of gap-filling ultralow-k dielectrics
Publication:
Cu passivation for integration of gap-filling ultralow-k dielectrics
Copy permalink
Date
2016
Journal article
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
34314.pdf
1.7 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Liping
;
de Marneffe, Jean-Francois
;
Lesniewska, Alicja
;
Verdonck, Patrick
;
Heylen, Nancy
;
Murdoch, Gayle
;
Croes, Kristof
;
Boemmels, Juergen
;
Tokei, Zsolt
;
De Gendt, Stefan
;
Baklanov, Mikhail
Journal
Applied Physics Letters
Abstract
Description
Statistics
Views
1971
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-01-26
Citations
Statistics
Views
1971
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-01-26
Citations