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Cu passivation for integration of gap-filling ultralow-k dielectrics

Date

2016
Journal article
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dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHeylen, Nancy
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhail
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-23T17:49:55Z
dc.date.available2021-10-23T17:49:55Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27661
dc.identifier.urlhttp://scitation.aip.org/content/aip/journal/apl/109/23/10.1063/1.4971774
dc.source.beginpage232901
dc.source.issue23
dc.source.journalApplied Physics Letters
dc.source.volume109
dc.title

Cu passivation for integration of gap-filling ultralow-k dielectrics

dc.typeJournal article
dspace.entity.typePublication
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