Browsing by Author "Balachandran, Jayaprakash"
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Publication Above-IC interconnects for high speed digital integrated circuits
Balachandran, JayaprakashPHD thesis2007-07Publication Accurate broadband parameter extraction methodology for S-parameter measurements
Proceedings paper2005, Proceedings of the 9th IEEE Workshop on Signal Propagation on Interconnects, 10/05/2005, p.57-60Publication Accurate Extraction of Time Domain Performance through Windowless Transforms
Oral presentation2003, IMAPS Advanced Technology Workshop - ATWPublication Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
Proceedings paper2003, Proceedings 33rd European Microwave Conference, 7/10/2003, p.301-304Publication Compact broadband resistance model for microstrip transmission lines
Proceedings paper2004, 13th Topical Meeting on Electrical Performance of Electronic Packaging - EPEP, 25/10/2004, p.83-86Publication Extending on-die wiring hierarchy with wafer-level packaging concepts
Proceedings paper2004, IEEE International Interconnect Technology Conference, 7/06/2004, p.105-107Publication Factors involved in performance optimisation of GHz chip-package co-design
Proceedings paper2004-11, Proceedings 37th IMAPS International Symposium on Microelectronics, 14/11/2004Publication Package level interconnect options
Proceedings paper2005, Proceedings of the International Workshop on System Level Interconnect Prediction, 2/04/2005, p.21-27Publication Packaging approach for nano-CMOS wiring
Proceedings paper2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference - EMPC, 12/06/2005, p.156-161Publication Time domain performance of leadless CSPs extracted from scattering parameter measurements and circuit models
Proceedings paper2003, 7th IEEE workshop on Signal Propagation on Interconnects, 11/05/2003, p.39-42