Browsing by Author "Beerten, Steven"
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Publication Electrodeposition for the synthesis of microsystems
Journal article2000, Journal of Micromechanics and Microengineering, (10) 2, p.101-107Publication Electrodeposition for the synthesis of microsystems
Proceedings paper1999, Proceedings of Micromechanics Europe, 27/09/1999, p.16-23Publication Flip-Chip Montage statt Draht-Bonden
Journal article2000, Produktion von Leiterplatten und Systemen, 7, p.1141-1143Publication Flip-chip redistribution using stencilprinted bumps
Oral presentation1999, Area Array Packaging Technologies WorkshopPublication Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Proceedings paper2000, IMAPS-EUROPE PRAGUE 2000. European Microelectronics Packaging and Interconnection Symposium Proceedings, 18/06/2000, p.41-44Publication Hermetically sealed on-chip packaging of MEMS devices
Proceedings paper2000, Proceedings European Space Components Conference - ESCCON, 21/03/2000, p.67-69