Browsing by Author "Besnard, G."
Now showing 1 - 2 of 2
- Results Per Page
- Sort Options
Publication 3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Proceedings paper2019, 2019 Symposia on VLSI Technology and Circuits, 9/06/2019, p.T56-T57