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3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters

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1972 since deposited on 2021-11-02
5last month
1last week
Acq. date: 2026-01-06

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1972 since deposited on 2021-11-02
5last month
1last week
Acq. date: 2026-01-06

Citations