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3D sequential low temperature top tier devices using dopant activation with excimer laser anneal and strained silicon as performance boosters
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1967 since deposited on 2021-11-02
1last month
Acq. date: 2025-12-11
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Metrics
Views
1967 since deposited on 2021-11-02
1last month
Acq. date: 2025-12-11
Citations