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Browsing by Author "Bossuyt, Frederick"

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    2.5/3D dynamically stretchable and permanently shaped electronic circuits

    Chtioui, Imen
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
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    Bedoui, Med Hedi
    Journal article
    2018, Microsystem Technologies, (20) 2, p.1-23
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    A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substrate

    Bossuyt, Frederick  
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    Vervust, Thomas  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Proceedings paper
    2009, 17th European Microelectronics and Packaging Conference & Exhibition - EMPC, 15/06/2009
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    A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

    Vanfleteren, Jan  
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    Bossuyt, Frederick  
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    Plovie, Bart
    Proceedings paper
    2016, 2016 12th International Congress Molded Interconnect Devices (MID), 28/09/2016, p.1-4
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    A novel concept for advanced modules with back-contact solar cells

    Govaerts, Jonathan  
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    Robbelein, Jo
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    Gong, Chun
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    Pawlak, Bartek  
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    Gonzalez, Mario  
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    De Wolf, Ingrid  
    Proceedings paper
    2010-10, 25th European Photovoltaic Solar Energy Conference and Exhibition / 5th World Conference on Photovoltaic Energy Conversion, 6/09/2010, p.3850-3853
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    A novel interconnect design with high stretchability and fine pitch capability for applications in stretchable electronics

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Proceedings paper
    2009, Materials and Devices for Flexible and Stretchable Electronics, 13/04/2009, p.1192-PP15-03
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    A Novel Method for Component Positioning in Thermoformed Electronics

    Madadnia, Behnam  
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
    Proceedings paper
    2023, 6th International Conference on System-Integrated Intelligence (SysInt), SEP 07-09, 2022, p.607-615
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    A reliable and comfortable package for wearable medical devices

    Sterken, Tom  
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    Vanfleteren, Jan  
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    Bossuyt, Frederick  
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    Brebels, Steven  
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    Christiaens, Wim
    Oral presentation
    2011, IMAPS Advanced Technology Workshop Microelectronic Packaging for Medical and Hi-Rel Devices
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    Adhesive bonding by SU-8 transfer for assembling microfluidic devices

    Salvo, Pietro
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    Verplancke, Rik  
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    Bossuyt, Frederick  
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    Latta, Daniel
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    Vandecasteele, Bjorn  
    Journal article
    2012, Microfluidics and Nanofluidics, (13) 6, p.987-991
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    Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers

    Plovie, Bart
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    Yang, Yang
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    Guillaume, Joren
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    Dunphy, Sheila  
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    Dhaenens, Kristof  
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    Van Put, Steven  
    Journal article
    2017, Advanced Engineering Materials, (19) 8, p.1700032
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    Arbitrarily shaped rigid and smart objects using stretchable interconnections

    Chtioui, Imen
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    Bossuyt, Frederick  
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    de Kok, Margreet
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    Vanfleteren, Jan  
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    Bedoui, M.H.
    Journal article
    2016, IEEE Transactions on Components, Packaging and Manufacturing Technology, (6) 4, p.533-544
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    Conformable electronics achieved by integration of foil-based electronics in textiles

    de Kok, M.
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    Pacheco, K.
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    Olotu, G.
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    van den Brand, J.
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    Cherenack, K.
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    van Os, K.
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    Bossuyt, Frederick  
    Proceedings paper
    2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012
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    Conformable, light emitting devices

    Jablonski, Michal
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
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    Cherenack, Kunigunde
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    Salem, Ahmed
    Meeting abstract
    2013, International Workshop on Flexible and Printable Electronics - IWFPE, 20/11/2013
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    Conformable, low level light therapy platform

    Jablonski, Michal
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    Bossuyt, Frederick  
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    Vanfleteren, Jan  
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    Vervust, Thomas  
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    De Smet, Herbert  
    Proceedings paper
    2014, Biophotonics: Photonic Solutions for Better Health Care IV, 14/04/2014, p.912921
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    Cyclic endurance reliability of stretchable electronic substrates

    Bossuyt, Frederick  
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    Guenther, J.
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    Löher, T.
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    Seckel, M.
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    Sterken, Tom  
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    De Vries, J.
    Journal article
    2011, Microelectronics Reliability, (51) 3, p.628-635
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    Design and analysis of a novel fine pitch and highly stretchable interconnect

    Hsu, Yung-Yu
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    Gonzalez, Mario  
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    Bossuyt, Frederick  
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    Axisa, Fabrice
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    Vanfleteren, Jan  
    Journal article
    2010, Microelectronics International, (27) 1, p.33-38
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    Design and fabrication of a flexible dielectric sensor system for in situ and real-time production monitoring of glass fibre reinforced composites

    Yang, Yang
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    Chiesura, Gabriele
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    Vervust, Thomas  
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    Bossuyt, Frederick  
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    Luyckx, Geert
    Journal article
    2016-06, Sensors and Actuators A: Physical, 243, p.103-110
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    Design and implementation of advanced systems in a flexible-stretchable technology for biomedical applications

    Carta, R.
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    Jourand, P.
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    Hermans, B.
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    Thoné, J.
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    Brosteaux, Dominique
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    Vervust, Thomas  
    Journal article
    2009, Sensors and Actuators A: Physical, (156) 1, p.79-87
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    Design and implementation of flexible and stretchable systems

    Gonzalez, Mario  
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    Vandevelde, Bart  
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    Christiaens, Wim
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    Hsu, Yung-Yu
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    Iker, Francois
    Journal article
    2011, Microelectronics Reliability, (51) 6, p.1069-1076
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    Design and performance of metal conductors for stretchable electronic circuits

    Gonzalez, Mario  
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    Axisa, Fabrice
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    Bossuyt, Frederick  
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    Hsu, Yung-Yu
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    Vandevelde, Bart  
    Proceedings paper
    2008, 2nd Electronics Systemintegration Technology Conference - STC, 1/09/2008, p.371-376
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    Design and performance of metal conductors for stretchable electronic circuits

    Gonzalez, Mario  
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    Axisa, Fabrice
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    Bossuyt, Frederick  
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    Hsu, Yung-Yu
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    Vandevelde, Bart  
    Journal article
    2009, Circuit World, (35) 1, p.22-29
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