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A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits
Publication:
A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits
Date
2016
Proceedings Paper
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43630.pdf
454.81 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
;
Bossuyt, Frederick
;
Plovie, Bart
Journal
Abstract
Description
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1945
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations
Metrics
Views
1945
since deposited on 2021-10-23
Acq. date: 2025-10-27
Citations