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A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

Date

2016
Proceedings Paper
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dc.contributor.authorVanfleteren, Jan
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorPlovie, Bart
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.date.accessioned2021-10-23T16:20:21Z
dc.date.available2021-10-23T16:20:21Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27491
dc.identifier.urlhttps://ieeexplore.ieee.org/document/7738924
dc.source.beginpage1
dc.source.conference2016 12th International Congress Molded Interconnect Devices (MID)
dc.source.conferencedate28/09/2016
dc.source.conferencelocationWurzburg Germany
dc.source.endpage4
dc.title

A new technology for rigid 3D free-form electronics based on the thermoplastic deformation of flat standard PCB type circuits

dc.typeProceedings paper
dspace.entity.typePublication
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