Browsing by Author "Bumueller, Dennis"
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Publication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Multi-tier die stacking through collective die-to-wafer hybrid bonding.
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.637-642