Publication:

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00106
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Author(s)

Kennes, Koen  
;
Lin, Ye  
;
Suhard, Samuel  
;
Bex, Pieter  
;
Cuypers, Dieter H.  
;
Guerrero, Alice
;
Bumueller, Dennis
;
Phommahaxay, Alain  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

N/A

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244 since deposited on 2024-12-07
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244 since deposited on 2024-12-07
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Acq. date: 2026-03-17

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