Publication:
Multi-tier die stacking through collective die-to-wafer hybrid bonding.
| dc.contributor.author | Kennes, Koen | |
| dc.contributor.author | Lin, Ye | |
| dc.contributor.author | Suhard, Samuel | |
| dc.contributor.author | Bex, Pieter | |
| dc.contributor.author | Cuypers, Dieter H. | |
| dc.contributor.author | Guerrero, Alice | |
| dc.contributor.author | Bumueller, Dennis | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Kennes, Koen | |
| dc.contributor.imecauthor | Lin, Ye | |
| dc.contributor.imecauthor | Suhard, Samuel | |
| dc.contributor.imecauthor | Bex, Pieter | |
| dc.contributor.imecauthor | Cuypers, Dieter H. | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Kennes, Koen::0000-0002-5987-2167 | |
| dc.contributor.orcidimec | Lin, Ye::0000-0002-0681-908X | |
| dc.contributor.orcidimec | Suhard, Samuel::0000-0002-6650-5947 | |
| dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2025-04-10T14:53:28Z | |
| dc.date.available | 2024-12-07T16:57:33Z | |
| dc.date.available | 2025-04-10T14:53:28Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00106 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44943 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 637 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 642 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Multi-tier die stacking through collective die-to-wafer hybrid bonding. | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |