Publication:

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00106
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dc.contributor.authorKennes, Koen
dc.contributor.authorLin, Ye
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorCuypers, Dieter
dc.contributor.authorGuerrero, Alice
dc.contributor.authorBumueller, Dennis
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorLin, Ye
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCuypers, Dieter H.
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecKennes, Koen::0000-0002-5987-2167
dc.contributor.orcidimecLin, Ye::0000-0002-0681-908X
dc.contributor.orcidimecSuhard, Samuel::0000-0002-6650-5947
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecBeyer, Gerald::0009-0001-0376-866X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2025-04-10T14:53:28Z
dc.date.available2024-12-07T16:57:33Z
dc.date.available2025-04-10T14:53:28Z
dc.date.issued2024
dc.identifier.doi10.1109/ECTC51529.2024.00106
dc.identifier.eisbn979-8-3503-7598-5
dc.identifier.isbn979-8-3503-7599-2
dc.identifier.issn0569-5503
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44943
dc.publisherIEEE COMPUTER SOC
dc.source.beginpage637
dc.source.conferenceIEEE 74th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedateMAY 28-31, 2024
dc.source.conferencelocationDenver
dc.source.endpage642
dc.source.journalN/A
dc.source.numberofpages6
dc.title

Multi-tier die stacking through collective die-to-wafer hybrid bonding.

dc.typeProceedings paper
dspace.entity.typePublication
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