Browsing by Author "Burggraf, Jurgen"

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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Iacovo, Serena
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Peng, Lan
;
Nagano, Fuya
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Uhrmann, Thomas
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Burggraf, Jurgen
;
Fehkuhrer, Andreas
Proceedings paper
2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2097-2104
Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

Wang, Jun
;
Mannarino, Manuel
;
Visker, Jakob
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Kang, Shuo
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Weidlinger, Gunther
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Wernicke, Tobias
Proceedings paper
2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.2008-2012