Publication:

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

Date

2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00342
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Author(s)

Wang, Jun  
;
Mannarino, Manuel  
;
Visker, Jakob  
;
Kang, Shuo  
;
Weidlinger, Gunther
;
Wernicke, Tobias
;
Burggraf, Jurgen
;
Wimplinger, Markus

Journal

N/A

Abstract

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242 since deposited on 2024-12-07
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242 since deposited on 2024-12-07
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Acq. date: 2026-04-26

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