Publication:
Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device
| dc.contributor.author | Wang, Jun | |
| dc.contributor.author | Mannarino, Manuel | |
| dc.contributor.author | Visker, Jakob | |
| dc.contributor.author | Kang, Shuo | |
| dc.contributor.author | Weidlinger, Gunther | |
| dc.contributor.author | Wernicke, Tobias | |
| dc.contributor.author | Burggraf, Jurgen | |
| dc.contributor.author | Wimplinger, Markus | |
| dc.contributor.imecauthor | Wang, Jun | |
| dc.contributor.imecauthor | Mannarino, Manuel | |
| dc.contributor.imecauthor | Kang, Shuo | |
| dc.contributor.imecauthor | Visker, Jakob | |
| dc.contributor.orcidimec | Wang, Jun::0009-0001-5615-9972 | |
| dc.contributor.orcidimec | Mannarino, Manuel::0009-0008-9574-3793 | |
| dc.contributor.orcidimec | Visker, Jakob::0009-0002-8930-0140 | |
| dc.date.accessioned | 2025-04-16T09:07:52Z | |
| dc.date.available | 2024-12-07T16:57:02Z | |
| dc.date.available | 2025-04-16T09:07:52Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00342 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44938 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 2008 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 2012 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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