Browsing by Author "Caers, J."
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Publication Optimal choice of the FEM damage volumes for estimation of the solder joint reliability for electronic package assemblies
Proceedings paper2003, Proceedings of the 53rd Electronic Components and Technology Conference, 27/05/2003, p.589-596Publication Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Journal article2003, ASME Journal of Electronic Packaging, (125) 4, p.498-805Publication Parametrised modelling of thermo-mechanical reliability
Proceedings paper2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.49-54Publication Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method
Proceedings paper2001, Proceedings 51st Electronic Components and Technology Conference, 29/05/2001, p.281-287Publication Thermo-mechanical reliability optimisation of small sized SMD components
Journal article1999, VTE - Aufbau und Verbindungstechnik in der Electronik, 2, p.88-92Publication Thermo-mechanical reliability optimisation of small sized SMD components
Proceedings paper1998, 3rd European Conf. on Electronic Packaging Technology and 9th Int. Conf. on Interconnection Technology in Electronics, 15/06/1998, p.100-102