Browsing by Author "Chavez, T."
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Publication Cu interconnect lifetime estimation in the presence of thermal gradients
Journal article2025, JOURNAL OF APPLIED PHYSICS, (137) 7, p.075106Publication Do's and don'ts for SiPho heater qualification
Proceedings paper2025, 2025 Conference on Smart Photonic and Optoelectronic Integrated Circuits, 2025-03-19, p.1337007-1-1337007-4Publication Quantifying the Impact of Thermal Gradients on Electromigration Lifetimes in 90 nm CD Cu Lines
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters
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