Publication:

Cu interconnect lifetime estimation in the presence of thermal gradients

Date

2025-FEB 21

Journal article

https://doi.org/10.1063/5.0245489

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Author(s)

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Pedreira, O. Varela

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Zahedmanesh, H.

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Journal

JOURNAL OF APPLIED PHYSICS

Statistics

188 since deposited on 2025-03-04

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Acq. date: 2026-01-26